Services

Services

Vestal offers value added component services to component manufacturers, component distributors and printed circuit boards assemblers. Value added services include: hot solder dip lead tinning, BGA re-balling, moisture bake-out, dry packaging, tape and reel packaging, tape splicing, lead forming, axial to radial conversion, axial component sequencing and axial component PCB insertion, radial component PCB insertion. All services are performed to applicable industry standards and or customer specifications. Static sensitive devices are handled in accordance with our ANSI/ESD S20.20ESD compliant control program.

Surface Mount Component Services

  • Hot Solder Dip Lead Tinning to IPC J-STD-001
  • BGA Re-balling to IPC/EIA J-STD-032
  • Tape and Reel to EIA-481
    • Bulk to Tape
    • Tube to Tape
    • Tray to Tape
    • Wafer to Tape
    • Waffle Pack to Tape
  • Moisture Bake-out to IPC/JEDEC J-STD-033
    • Dry Packaging
  • Carrier Tape Splicing
 

Pass through-Hole Component Services

  • Axial
    • Hot Solder Dip Lead Tinning to IPC J-STD-001
    • Tape and Reel to EIA-296
    • Lead Forming and Trimming
    • Component Sequencing for Automatic Insertion
    • PCB Insertion
  • Radial
    • Hot Solder Dip Lead Tinning to IPC J-STD-001
    • Tape and Reel to EIA-468
    • Lead Forming and Trimming
    • Axial to Radial Conversions
    • PCB Insertion
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